High-temperature Cyclic Fatigue-crack Growth Behavior in an in Situ Toughened Silicon Carbide

 The growth of fatigue cracks at elevated temperatures (25–1300°C) is examined under cyclic loading in an in situ toughened, monolithic silicon carbide with Al-B-C additions (termed ABC–SiC), with specific emphasis on the roles of temperature, load ratio, cyclic frequency, and loading mode (static vs. cyclic). Extensive crack-growth data are presented, based on measurements from an electrical potential-drop crack-monitoring technique, adapted for use on ceramics at high temperatures. It was found that at equivalent stress-intensity levels, crack velocities under cyclic loads were significantly faster than those under static loads. Fatigue thresholds were found to decrease with increasing temperature up to 1200°C; behavior at 1300°C, however, was similar to that at 1200°C. Moreover, no effect of frequency was detected (between 3 and 1000 Hz), nor evidence of creep cavitation or crack bridging by viscous ligaments or grain-boundary glassy phases in the crack wake. Indeed, fractography and crack-path sectioning revealed a fracture mode at 1200–1300°C that was essentially identical to that at room temperature, i.e. predominantly intergranular cracking with evidence of grain bridging in the crack wake. Such excellent crack-growth resistance is attributed to a process of grain-boundary microstructural evolution at elevated temperatures, specifically involving crystallization of the amorphous grain-boundary films/phases. © 2000 Acta Metallurgica Inc. Published by Elsevier Ltd. All rights reserved.